Academic Call

Call for Research Papers

Paper Abstract Submission

Submit your abstract and paper details for review by the IDSPS Technical Advisory Board (TAB).

Primary Author Name *

Corresponding Email *

Institution / University *

Research SRA Category *

Research Paper Title *

Abstract Summary (Max 500 words) *

Upload PDF Draft / Abstract *

PDF files only (max 10MB)

Scope of Submissions

We invite original research papers aligning with the 9 Strategic Research Areas:

Advanced Packaging: 3D Glass Chiplet packages, PDN optimizations, coreless RDL, micro-lithography.
Power Modules: SiC/GaN module stackups, Active Metal Brazing (AMB), sintered attachments.
Reliability: Multi-physics reliability modeling, thermo-mechanical fatigue, insulation breakdown.
Substrates: Ceramic, DBC, organic substrates, embedded passives.
Opto-Electronics: Glass-integrated waveguides, alignment of fiber arrays, photonic interconnects.
Thermal: Immersion cooling, two-phase cooling, micro-channel heat exchangers.

Submission Guidelines

Abstracts must contain original work and clearly specify the SRA domain. Upon TAB approval, authors will be invited to present at the next Industry Consortium Meeting (ICM) and submit the full manuscript to IEEE-IDSPS portals.