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The IDSPS program is a mission-mode initiative that brings together 10 elite IITs, IISc, BITS Pilani, and global industry partners to co-develop manufacturable prototypes using the 3 pilot lines in: 1. Advanced packaging, 2. Integrated Optoelectronics, and 3. Integrated Power Electronics
Developing advanced silicon interposers and 3D chiplet prototypes.
Educating over 1,700 technical engineers and Ph.D. scholars annually.
Co-developing systems with 50+ global industry partners and financing deep-tech semiconductor startups.
The Indian Design, Semiconductors, Packaging and Systems Program (IDSPS) is a national R&D, educated-workforce, and global supply-chain initiative. It builds India's strategic capabilities in advanced packaging and systems to enable sustainable manufacturing growth in the AI era.
Together we Can
We are a national team 11 Institutes ( 9IITs, IISc, BITS P) Industry consortium member companies, developers, manufacturers, suppliers, users to create a semiconductor ecosystem
Lauched by ISM CEO Shri Amitesh Sinha, ARNF CEO Shri Shivkumar Kalyanaraman, Prl.Secretaries of UP and Odisha states. Diretors, Faculty and students of 9 IITs and...
IDSPS Industry Consortium was launched with 200+ person IDSPS Team on August 30, 2025, in Delhi on the eve of SemiconIndia 2025.
India aims to be a global DSPS hub by strengthening R&D, manufacturing, and design using ISM and IDSPS initiatives.
IDSPS drives next-gen designs, skilled workforce development, and IP creation to boost India's semiconductor growth.
It enables global supply-chain ties, supports startups, and advances women's roles in the semiconductor industry.
India envisions becoming a global hub in DSPS technologies by strengthening R&D and manufacturing through strategic initiatives like ISM and IDSPS.
India's strong academics and design skills attract global investment in affordable, high-quality electronics.
IDSPS targets future tech - optoelectronics, chiplets, and hybrid bonding for next-gen semiconductor manufacturing.
The program advances sustainable chiplet packaging and AI-era manufacturing to elevate India globally.
A national team of 11 premier institutions (9 IITs, IISc, BITS Pilani) advancing cutting-edge packaging R&D, workforce education, and deep-tech innovation.
Leading international semiconductor design toolmakers, substrate manufacturers, assembly tool providers, and metrology companies building a robust supply chain.
Strategic alignment with India Semiconductor Mission (ISM), MeitY, and state industrial policies to accelerate indigenous semiconductor ecosystem growth.
Key technology domains driving innovation in semiconductors, packaging systems, and advanced manufacturing across India's premier institutions.
