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India should be very proud of setting up 10 historic semiconductor and package manufacturing plants throughout India. These facilities demonstrate, for the first time, that India possesses the essential manufacturing infrastructure needed to participate meaningfully in this strategic sector.
However, achieving the three core goals of IDSPS: 1) Next-generation industrial R&D, 2) Highly skilled workforce, and 3) Strong global industry partnerships requires a far more integrated national effort. This cannot be accomplished by manufacturing investments alone. The success of the Advanced Packaging initiative hinges on a four-way collaboration among:
Invest & Benefit from:
Providing national vision, policy leadership, and funding. Currently, MeitY and ANRF are the federal agencies funding this Advanced Packaging effort.
Enabling local infrastructure support, fast-track approvals, financial incentives, and ecosystem facilitation for the co-development centers.
Driving innovations, talent development, and technology creation across top-tier institutions, including 6 IITs, IISc, and BITS Pilani.
Contributing real-world requirements, advanced tools, supply-chain access, co-development staff, and pathways to commercialization.
Only through this coordinated and strategic partnership can India bridge existing technology gaps, accelerate indigenous capability, and position itself as a competitive and sustainable global leader in semiconductor advanced packaging.