Vision & Mission

IDSPS is a National R&D, educated workforce and an industry partnership initiative to build India to the forefront of global R&D from design to semiconductors to packaging and systems.

It involving the top 50 research academic institutions and about 50 global companies, initially, all working together plans to set up 9 national industry co-development centers in 9 strategic semiconductors-to-systems technologies at 7 IITs, IISc and BITS Pilani and integrate those foundational advances at two system integration hubs into two types of interdisciplinary national test-vehicles & prototypes:

• 2.5D and 3D chiplet modules for AI at IIT Gandhinagar
• 3D Double-sided, liquid-cooled SiC and GaN ultra-high-power modules at IIT Bhubaneswar.

While the initial ISM-subsidized manufacturing lines in Gujarat and Assam are based on legacy-node technologies, the rest of the advanced world is focusing on 2030 manufacturing technologies such as:

• optoelectronics for computing,
• compound semiconductors to form ultrahigh density integrated power modules for electric cars,
• glass panel chiplet packaging to 1 micron lithography in 3D chiplet architectures,
• and copper-to-copper or hybrid bonding,
• and assembly, replacing solders, for AI era in view of slowdown of Moore’s Law, and assembly, replacing solders, for AI era in view of slowdown of Moore’s Law.

These are exactly the same technologies being developed in the IDSPS program to bring India to global level with a sustainable manufacturing path.