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A technology-ready workforce is the single most critical challenge for India's emerging semiconductor ecosystem. While India has built strong capabilities in design, it lacks depth in semiconductor, package and systems technologies. World-class education is possible only when it is tightly integrated with world-class R&D, hence the creation of the 9 Strategic Research Areas (SRAs) and their associated research programs.
Faculty across participating institutions will develop new courses, curricula, and textbooks aligned with their SRA. Each institution will offer two categories of courses: (a) SRA-linked R&D courses, and (b) Hands-on laboratory courses, one focused on integrated package substrates and the other on assembly and test.
These "Design-Build-Operate" (DBO) courses are essential to prepare students for real manufacturing environments at BTech and MTech levels.
Specialized upskilling programs will be offered to engineers from industry to bridge gaps in advanced power modules such as materials, processes, assembly and test.
Leading-edge research in the SRAs will supplement classroom teaching at the master's and doctoral levels, ensuring that India develops deep expertise.
Emphasizing signal and power integrity, large-area lithography, dielectric/conductor formation, and electrical test.
Aligned with the needs of new manufacturing units in Odisha, Gujarat and Assam. Students will gain hands-on experience in die and module design, die-attach sintering, integrated module assembly using advanced power interconnects, and reliability assessments under high-voltage and high-current conditions.
India's path to becoming a product nation in the power sector requires large-scale manufacturing. There are two broad categories of manufacturing:
Student enrollment targets across all strategic research and technology areas.
| Technology Area | B.Tech | M.Tech | Ph.D. |
|---|---|---|---|
| 1. Package Design & Architectures | 215 | 45 | 30 |
| 2. Design for Mech. Reliability | 150 | 70 | 25 |
| 3. Power Electronics and Module Design | 215 | 45 | 30 |
| 4. Materials for Comp. & Pkg. | 150 | 70 | 20 |
| 5. Integrated opto-electronics | 150 | 70 | 20 |
| 6. Interconnecting Substrates | 180 | 90 | 20 |
| 7. IC & Board assembly and reliability | 150 | 70 | 20 |
| 8. Thermal Technologies | 100 | 75 | 50 |
| 9. Electrical Test | 40 | 60 | 20 |
| Total | 1135 | 550 | 185 |
While India is rapidly developing assembly capabilities, the nation urgently needs to build deep expertise in chemical and materials-based semiconductor and package manufacturing. The proposed workforce development strategy directly addresses this gap. Fig 11 presents one of the most comprehensive educational frameworks ever proposed, either in India or globally. It outlines a structured set of programs designed to produce a large, high-quality workforce of electrical, mechanical, computer, materials and chemical engineers at the BTech, MTech and PhD levels across all eight strategic technology areas.