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Access our webinar series on advanced packaging, wide-bandgap integrated power modules, opto-electronics, and testing technologies.
Explore the latest developments in 1-micron lithography, copper-to-copper hybrid bonding, and mechanical reliability of glass substrates.
Prof. Rao Tummala
CEO, IDSPS Division
We regularly host technical lectures with world-class faculty and industry leads.
A detailed review of active metal brazing (AMB) processes, transient liquid phase bonding, and thermal optimization for SiC/GaN systems.
Workflows for dynamic characterization, double-pulse testing, and electromagnetic interference shielding on module substrates.