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IEEE is the world's largest technical professional organization with 140-year history as a trusted voice for engineering. IEEE brings together student and professional members across the globe to innovate as a community through highly cited publications, conferences, technology standards, and professional and educational activities. It has over 486,000 members in more than 190 countries. IEEE has 39 technical Societies and eight Technical Councils representing a wide range of IEEE technical interests. The IEEE Electronics Packaging Society is a natural leadership partner for IDSPS since both share a common goal of systems integration.
IMAPS is a premier, non-profit Professional Society with headquarters in US for communicating, educating, and interacting within academia, industry and government.
It was founded in 1967 and currently has 3,000 student, professional and corporate membership. Its core technologies are heterogeneous integration, chiplets, FOWLP, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, package design/modeling, interconnects, flip chip, MEMS, sensors, RF/wireless, signal/power integrity, advanced materials, substrates and more.
IMAPS is interested in offering a comprehensive set of programs customized for India such as online tutorials on legacy technologies, Advanced Technology Workshops related to 12 SRAs and in person tutorials on emerging technologies.
One week of in-person courses at one academic institute in legacy or traditional technologies to educate technicians and manufacturing engineers. Four tutors will travel to India for 1 week at a time, twice a year for five years
Budget: INR 2.5 Crores for five years
IMAPS: 12 Weekly Online courses on legacy packaging topics relating to 12 SRAs. Payment to each tutor and an administrative fee to IMAPS for managing the tutorial series.
Budget: INR 1.5 Crores for five years
Focused on technology advancements and roadmaps in the 12 SRAs involving Indian and global faculty and Indian and global companies organized and managed by IMAPS or IEEE-EPS in partnership with IESA. Funding of $20,000 for each ATW is requested by IMAPS from Govt. of India to cover 4 invited/keynote speakers from US to travel to India and additional IMAPS administrative fees. In addition, IMAPS anticipates sharing of registration fees and IESA providing and additional $10,000 per ATW to IMAPS. This would cover the total costs incurred by IMAPS for each ATW.
Budget: INR 5 Crores for five years