IDSPS IAB 2026

Industry Advisory board Meeting (IAB).

Design, Semiconductors, Packaging and Systems for India and the World

30+
Industry
150+
Participants
50+
Academic Partners
IDSPS Research Centers across India

National Semiconductor Industry Consortium

Purpose of the Industry Consortium Conference

The consortium meeting is a closed-door session convened to formally launch the Industry Consortium and the Industry Advisory Board. It brings together SRA leads, industry leads, senior executives, and technology experts to establish the foundation for executing the consortium program. Discussions will focus on currently agreed projects across the ten Strategic Research Areas, future plans, and feedback from industry executives and technology experts, which will be incorporated into program execution.

50+

Academic & Research Centers

Nationwide

Consortium-Level Collaboration

Global

Industry & Academic Participation

Design, Semiconductors, Packaging and Systems for India and the World (DSPS)

Mark the Date

Feb27

27–28 February, 2026

Add to Calendar

Welcome Reception on Feb 26, 2026 | 7:30 PM – 9:00 PM, followed by Dinner

The Venue

Academic Block 10, Room # 103

Conference Agenda

Two Days of Transformative Collaboration

Structured sessions bridging design, packaging, systems, and power electronics—led by global thought leaders.

10:30 AM

Welcome Address

Prof. Rajat Moona, Director, IIT Gandhinagar
10:45 AM

Inaugural Panel

Prof. Rao Tummala, IDSPS
Ashok Chandak, President IESA, SEMI
Navin Bishnoy, Marvell
Prof. Shreepad Karmalkar, Director IITBBS
Ms. P Bharathi, Secretary, DST, Gujarat
Shri Vishal K Dev, Prl. Secy, IT&E, Odisha
11:30 AM

IDSPS Industry Consortium: Vision, Strategy, Programs & Plans

Prof. Rao Tummala
12:15 PM

Role of IAB in IDSPS Industry Consortium

Navin Bishnoi, Chair of IAB, Marvell
12:25 PM

Advanced Packaging: Industry Keynote

Lee Chee Ping, Lam Research
12:45 PM

Lunch Break

01:45 PM

Advanced Packaging Sessions

1. Package Design (Electrical)
Introduction to SRA — Prof. Rohit Sharma, IIT RPR & 3 Faculty Leads
Keynote 1: Venkata Simhadri, ASIP — Next Gen Design Challenges
Keynote 2: Vaishnav Srinivas, Qualcomm — Next Gen Design Challenges
2. Package Design (Mechanical)
Introduction to SRA — Prof. Venkatesh KP, BITS P & 3 Faculty Leads
Industry Keynote: Shital Joshi, Synopsys — Next Gen Mechanical Design Challenges
3. Materials for Components & Packaging
Introduction to SRA — Prof. Praveen R, IISc B & Prof. Murali KP, NITC & 3 Faculty Leads
Keynote 1: Ikeuchi T, Resonac — Advanced Semiconductor Packaging
Keynote 2: Rakesh Gupta, Baba Fine Chemicals
4. Interconnecting Substrates
Introduction to SRA — Prof. Pradeep Dixit, IITB & 3 Faculty Leads
Industry Keynote: Biju Thomas, MKS — Next Gen Substrate Challenges
5. Integrated Opto-Electronics
Introduction to SRA — Prof. Naresh Emani, IITH & 3 Faculty Leads
Industry Keynote: Sai Ankireddi, ADI — Next Gen Opto-Electronics Challenges
6. IC & Board Assembly
Introduction to SRA — Prof. Nilesh Badwe, IITK & 3 Faculty Leads
Industry Keynote: Ravi Bhatkal, MacDermid — Next Gen Board Assembly Challenges
Key Session
07:00 PM

Networking Dinner

All IAB Participants

Conference Venue

Academic Block 10, Room # 103
46 Featured Experts

The Minds Powering India's Silicon Vision

Visionaries, Industry Leaders, and Academic Pioneers shaping the future of Semiconductors and Systems in India.

Academic · Industry · Government
Chapter 1

SESSION 1: INAUGURAL

Welcome Address

Welcome Address
Prof. Rajat Moona

Prof. Rajat Moona

Director

IIT Gandhinagar

Inaugural Panel

Panel Member
PT

Prof. Rao Tummala

IDSPS

IDSPS
Panel Member
AC

Ashok Chandak

President

IESA, SEMI
Panel Member
NB

Navin Bishnoy

Marvell

Marvell
Panel Member
PK

Prof. Shreepad Karmalkar

Director

IITBBS
Panel Member
MB

Ms. P Bharathi

Secretary

DST, Gujarat
Panel Member
SD

Shri Vishal K Dev

Prl. Secy

IT&E, Odisha

IDSPS Industry Consortium: Vision, Strategy, Programs & Plans

Speaker
PT

Prof. Rao Tummala

Consortium Lead

IDSPS

Role of IAB in IDSPS Industry Consortium

Speaker
NB

Navin Bishnoi

Chair of IAB

Marvell
Chapter 2

SESSION 2: ADVANCED PACKAGING

Industry Keynote

Keynote
LP

Lee Chee Ping

Industry Keynote

Lam Research

1. Package Design (Electrical)

SRA Introduction
PS

Prof. Rohit Sharma

SRA Lead

IIT RPR
Keynote
Venkata Simhadri

Venkata Simhadri

Next Gen Design Challenges

ASIP
Keynote
VS

Vaishnav Srinivas

Next Gen Design Challenges

Qualcomm

2. Package Design (Mechanical)

SRA Introduction
PK

Prof. Venkatesh KP

SRA Lead

BITS P
Keynote
SJ

Shital Joshi

Mechanical Design Challenges

Synopsys

3. Materials for Components & Packaging

SRA Introduction
PR

Prof. Praveen R

SRA Lead

IISc B
SRA Introduction
PK

Prof. Murali KP

SRA Lead

NITC
Keynote
IT

Ikeuchi T

Advanced Packaging

Resonac
Keynote
RG

Rakesh Gupta

Baba Fine Chemicals

Baba Fine Chemicals

4. Interconnecting Substrates

SRA Introduction
Prof. Pradeep Dixit

Prof. Pradeep Dixit

SRA Lead

IITB
Keynote
BT

Biju Thomas

Next Gen Substrate Challenges

MKS

5. Integrated Opto-Electronics

SRA Introduction
Prof. Naresh Emani

Prof. Naresh Emani

SRA Lead

IITH
Keynote
SA

Sai Ankireddi

Opto-Electronics Challenges

ADI

6. IC & Board Assembly

SRA Introduction
Prof. Nilesh Badwe

Prof. Nilesh Badwe

SRA Lead

IITK
Keynote
RB

Ravi Bhatkal

Board Assembly Challenges

MacDermid

7. Thermal Technologies

SRA Introduction
PB

Prof. Anandaroop Bhattacharya

SRA Lead

IIT KGP
Keynote
RM

Ravi Mahajan

Next Gen Thermal Challenges

Intel

8. Substrate Module & System Level Electrical Test

SRA Introduction
Prof. Jaynarayan Tudu

Prof. Jaynarayan Tudu

R&D Lead

IIT TP
Keynote
NB

Navin Bishnoi

Electrical Test Challenges

Marvell
Chapter 3

SESSION 3: INTEGRATED POWER ELECTRONICS

Industry Keynote

Keynote
SA

Shalu Agarwal

Yole Group

Yole

1. Power Module Design

SRA Introduction
PC

Prof. Shiladri C

SRA Lead

IITB
Keynote
KG

Kartik G

Design Challenges

Infineon

2. Package Design (Mechanical)

Expert
PK

Prof. Venkatesh KP

Literature Review

BITS P

3. Power Electronics & Devices

Expert
PP

Prof. Sathyam P

Intro to Power Electronics

IIT BBS
Expert
PK

Prof. Akshay K

Intro to Power Devices

IIT BBS
Keynote
MT

Maurus T

Next Gen Power Devices

Evatec
Keynote
Sriram R

Sriram R

Power Component Challenges

Texas Instruments

4. Power Substrates

Expert
PR

Prof. Praveen Ramamurthy

Literature Review

IISc

5. Thermal Technologies for Power Systems

Expert
PA

Prof. Anandaroop

Literature Review

IIT KGP

6. Di-attach & Assembly of Power Devices

SRA Introduction
Prof. Nilesh Badwe

Prof. Nilesh Badwe

SRA Lead

IIT K
Keynote
SK

Sri Krishna

Di-attach Challenges

CuNex

7. Substrate Module & System Level Electrical Test

Keynote
AM

Anand M

Electrical Test Challenges

Tessolve
Chapter 4

SESSION 4: PILOT LINE INFRASTRUCTURE

Advanced Packaging Pilot Line

Pilot Line
Nihar Mahopatra

Nihar Mahopatra

IITGN Lead

IITGN
Pilot Line
PA

Prof. Tarun Agarwal

IITGN Lead

IITGN

Integrated Power Electronics Pilot Line

Pilot Line
PP

Prof. Satyam Parlapalli

IITBBS Lead

IITBBS
Chapter 5

SESSION 5: SUMMARY & ACTIONS

Summary, Actions and Future Plans

Strategy
NB

Navin Bishnoi

IAB Chair

IDSPS
Expert
Expert
Expert
Expert
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Event Details

Name of the Event

National Semiconductor Consortium

Organiser

IDSPS, IESA

Address

Academic Block 10, Room # 103