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Explore peer-reviewed research papers, technical publications, and consortium reports authored by IDSPS faculty leaders and partner institutions.
Published research papers, technical monographs, and consortium whitepapers will be posted directly here as they become available. All papers are archived for open access download by researchers, students, and industry engineers.
This paper presents a novel high-density 3D interconnect architecture tailored for multi-chiplet AI accelerators, addressing thermal dissipate limits and electrical signal integrity.
Demonstrating monolithic silicon photonic transceivers with ultra-low latency and sub-picojoule energy per bit performance for next-gen data centers.
Comprehensive fatigue analysis and microstructural characterization of fine-pitch copper TGV/TPV interconnects in advanced glass substrates.
Design and thermal management of wide-bandgap GaN and SiC power modules enabling 99%+ efficiency in AI data center power supplies.
Automated test pattern generation and high-throughput probing for high-density interposers and multi-chiplet 2.5D/3D assemblies.
Submit your manuscript for review by the IDSPS Technical Advisory Board (TAB). Approved papers will be published directly in the repository above.
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