Loading IDSPS Consortium
Emeritus Professor, Georgia Tech & Former IBM Fellow — Father of Advanced Packaging (IEEE) — Advisor, Indian Semiconductor Mission (ISM)
India stands at a historic turning point in its journey toward becoming a global leader in semiconductors, electronics, and advanced systems technologies. Over the last several years, I have had the privilege of working closely with government leaders, industry executives, university researchers, and entrepreneurs who share a common vision—to build a vibrant, self-reliant, and globally competitive technology ecosystem for India.
My engagement with India's semiconductor mission began through an invitation by the Hon. Minister Vaishnaw to advise the ISM. Since then, I have witnessed remarkable progress. India is creating foundational manufacturing capabilities through legacy semiconductor and package manufacturing facilities, while simultaneously investing in breakthrough technologies through initiatives such as the National Quantum Mission. I have created IDSPS to bridge the gap between the two, providing India with a unique opportunity to build a seamless roadmap from today's manufacturing base to the next generation of technologies that will define the future.
The Indian Design, Semiconductors, Packaging and Systems (IDSPS) was created to help accelerate this journey. Our mission is to bridge the gap between India and advanced countries in research, education, industry and supply-chain partnerships, innovation, and manufacturing by bringing together industry, academia, government, and startups through a collaborative global ecosystem.
Drawing upon successful industry–university partnership models I developed at Georgia Tech, IDSPS seeks to advance two critical objectives:
Through our 11 industry co-development technology centers at IIITs/IISc and BITs, three system integration innovation hubs in Gujarat, Odisha and AP, workforce development programs, industry consortiums, and international collaborations, IDSPS aims to help create an unprecedented pipeline of talent, innovation, and entrepreneurship.
Our goal is not merely to catch up with global technology leaders, but to position India as a leading contributor to the world that will shape the coming decades.
I invite industry partners, researchers, educators, students, policymakers, and innovators around the world to join us in this mission. Together, we can build an ecosystem that accelerates innovation, strengthens manufacturing, develops world-class talent, and creates lasting economic and societal impact for all.
The future of AI with semiconductors and systems will be shaped by intense and deep R&D in all AI technologies and global collaborations. IDSPS is committed to being a catalyst for that future.
Prof. Rao Tummala
Chief Executive Officer (CEO)
Indian Design, Semiconductors, Packaging and Systems (IDSPS)