Loading IDSPS Consortium
Loading IDSPS Consortium
As per the National Strategy for Semiconductor Workforce Development, each SRA offers academic and hands-on courses aligned with industry and R&D requirements.
| SRA Code | Technology Area | Course Focus & Streams | Format / Tools |
|---|---|---|---|
| SRA-1 | Package Design & Architectures | Chip-Package co-design, EMI, ESD | CAD/EDA Tools |
| SRA-2 | Design for Mech. Reliability | Multi-physics reliability, AI-based simulations | Thermal/Mechanical |
| SRA-3 | Power Electronics and Module Design | Integrated modules, packaging for power ICs | Power Simulation |
| SRA-4 | Interconnecting Electronic Substrates | HDI, Coreless RDL, Via formation | Process Engineering |
| SRA-5 | Integrated Opto-Electronics | Fiber coupling, Photonic interconnects | Assembly + Design |
| SRA-6 | Materials: Devices, Components, Packaging | New materials, Stress analysis | Materials Science |
| SRA-7 | IC & Board Assembly & Reliability | Sintering, Flip-chip, reliability prediction | Reliability Labs |
| SRA-8 | Thermal Technologies | Liquid cooling, immersion cooling, LHPs | Thermal Labs |
| SRA-9 | System Level Electrical Test | Test automation, mixed-signal testing | EDA Tools & Labs |