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Research Areas

Integrated Power Electronics

Double-Side Liquid-Cooled DBC Substrate Integrated Power Module as a National Test Vehicle

Cross-section of proposed national test vehicle in N-IPERC

Cross-section of proposed national test vehicle in N-IPERC

7 Technologies at 7 National Industry Co-development Technology Centres & System Integration Research Center at IIT Bhubaneswar

Fig. Integrated Power Electronics requires 7 strategic foundational technologies and System Integration Research Center at IIT Bhubaneswar

Fig. Integrated Power Electronics requires 7 strategic foundational technologies and System Integration Research Center at IIT Bhubaneswar

To position India as a global leader in the green energy transition and a true product nation, it must build deep expertise and infrastructure across 7 strategic technologies. These areas, referred to as Strategic Research Areas (SRAs), each encompass multiple high-impact research themes. Together, they form the foundation for establishing 7 Industry Co-development Technology Centres (ICCs), along with the System Integration Research Center at IIT Bhubaneswar, one dedicated to each SRA. These ICCs will work in partnership with leading global companies to design, develop, and demonstrate next-generation, industry-ready technologies. IIT Bhubaneswar will serve as the central hub (N-IPERC) and the System Integration Research Center, where advances from all 7 centres will be integrated through a pilot line to build advanced, manufacturable Integrated Power Electronics prototypes. Each ICC will operate its own industry consortium, developing technologies for real industrial test vehicles such as high-density power modules, thereby accelerating India’s capability for world-class power semiconductor productization.

7 Co-development Centres at 7 Academic Institutions Participating in the N-IPERC

Power Module Design IIT Bombay Power Substrates IIT Bombay Thermal Tech. for Power Systems IIT Kharagpur System Level Electrical Test IIT Tirupati Design for Mechanical Reliability BITS Pilani Die-attach & Assembly of Power Devices IIT Kanpur Materials for Comp. & Pkg. IISc Bangalore / NIT Calicut NATIONAL CENTER Integrated Power Electronics Hub @ IIT BBS

Figure 9: Integrated Power Electronics Hub @ IIT BBS Converging 7 Strategic Technologies

Power Module Design (Electrical) @ IIT B
  • Advanced Power Architectures
  • Parasitic Inductance Optimization
  • Design with Wide-Bandgap (SiC/GaN) Components
  • Design for High Efficiency and Power Density
Power Module Design (Mechanical) @ BITS Pilani
  • Power Module Design for Mechanical Reliability
  • Mechanical Design of High-Density Interconnects
  • 3D Integrated Power Module Structural Analysis
Material and Components @ IISc Bangalore
  • Advanced Power Materials & Components
  • Ceramic Substrate Materials (AlN, Si₃N₄)
  • High-Temperature Die-Attach Materials
  • Encapsulants & Silicone Gels
  • High-Performance Thermal Interface Materials (TIMs)
Power Substrates @ IITB
  • Direct Bonded Copper (DBC) Processing
  • Active Metal Brazing (AMB) for SiC Modules
  • High-Conductivity Metallization
  • High Aspect Ratio Vias for Power Stackups
  • Embedded Passive Components in Substrates
  • High-Voltage Insulating Substrates
IC and Board Assembly @ IITK
  • Power IC Assembly and Packaging
  • Sintered Silver (Ag) and Copper (Cu) Die Attach
  • Combined Thermo-mechanical + Power Cycling Test
  • Low-Temperature Solder & Transient Liquid Phase Bonding
  • Automotive Power Electronics Assembly
  • Assembly for Extreme Reliability and High-Temp Operation
Thermal Technologies @ IITKGP
  • Within-Module Thermal Design and Technologies
  • Advanced Heat Sink and Cold Plate Integration
  • Ultra-high Thermal Conductivity Substrate Optimization
  • System Level Cooling for Power Converters
  • Automotive Liquid Cooling Systems
  • Two-phase and Immersion Cooling for Power Electronics
Electrical Test @ IIT TP
  • High-Voltage and High-Current Testing
  • Dynamic Characterization (Double Pulse Testing)
  • Substrate and Insulation Breakdown Testing
  • Integrated Power Module Reliability Testing
  • Electromagnetic Interference (EMI/EMC) Testing