Research Areas

Integrated Power Electronics

Double-Side Liquid-Cooled DBC Substrate Integrated Power Module as a National Test Vehicle

Cross-section of proposed national test vehicle in N-IPERC

8 Technologies at 8 National Industry Co-development Technology Centres

Fig. Integrated Power Electronics requires 8 strategic foundational technologies

To position India as a global leader in the green energy transition and a true product nation, it must build deep expertise and infrastructure across eight strategic technologies. These areas, referred to as Strategic Research Areas (SRAs), each encompass multiple high-impact research themes. Together, they form the foundation for establishing eight Industry Co-development Technology Centres (ICCs), one dedicated to each SRA. These ICCs will work in partnership with leading global companies to design, develop, and demonstrate next-generation, industry-ready technologies. IIT Bhubaneswar will serve as the central hub (N-IPERC) and the system integration centre, where advances from all eight centres will be integrated through a pilot line to build advanced, manufacturable Integrated Power Electronics prototypes. Each ICC will operate its own industry consortium, developing technologies for real industrial test vehicles such as high-density power modules, thereby accelerating India’s capability for world-class power semiconductor productization.

8 Industry Co-development Centres at 7 Academic Institutions Participating in the N-IPERC

Fig. 9: 8+1 ICCs working with N-IPERC for next-generation integrated power modules.

Power Module Design (Electrical) @ IIT B

Advanced Power Architectures
Parasitic Inductance Optimization
Design with Wide-Bandgap (SiC/GaN) Components
Design for High Efficiency and Power Density

Power Module Design (Mechanical) @ BITS Pilani

Power Module Design for Mechanical Reliability
Mechanical Design of High-Density Interconnects
3D Integrated Power Module Structural Analysis

Material and Components @ IISc Bangalore

Advanced Power Materials & Components
Ceramic Substrate Materials (AlN, Si₃N₄)
High-Temperature Die-Attach Materials
Encapsulants & Silicone Gels
High-Performance Thermal Interface Materials (TIMs)

Power Substrates @ IITB

Direct Bonded Copper (DBC) Processing
Active Metal Brazing (AMB) for SiC Modules
High-Conductivity Metallization
High Aspect Ratio Vias for Power Stackups
Embedded Passive Components in Substrates
High-Voltage Insulating Substrates

Power Electronic Device-Module Co-Optimization @ IIT BBS

Device & Module/Package co-design for superior performance
Optimization of die parameters with power module design
Advanced device architectures for power electronics

IC and Board Assembly @ IITK

Power IC Assembly and Packaging
Sintered Silver (Ag) and Copper (Cu) Die Attach
Combined Thermo-mechanical + Power Cycling Test
Low-Temperature Solder & Transient Liquid Phase Bonding
Automotive Power Electronics Assembly
Assembly for Extreme Reliability and High-Temp Operation

Thermal Technologies @ IITKGP

Within-Module Thermal Design and Technologies
Advanced Heat Sink and Cold Plate Integration
Ultra-high Thermal Conductivity Substrate Optimization
System Level Cooling for Power Converters
Automotive Liquid Cooling Systems
Two-phase and Immersion Cooling for Power Electronics

Electrical Test @ IIT TP

High-Voltage and High-Current Testing
Dynamic Characterization (Double Pulse Testing)
Substrate and Insulation Breakdown Testing
Integrated Power Module Reliability Testing
Electromagnetic Interference (EMI/EMC) Testing

Innovations from all eight centres will converge at IITBBS system integration R&D centre and pilot line to create next-generation advanced power modules.

Integrated Power Electronics Centres converging at N-IPERC, IIT Bhubaneswar

National Integrated Power Electronics Research Center (N-IPERC Hub) • IIT Bhubaneswar Pilot Line